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SP1ML Hardware design

2.4 Recommended footprint

Figure 5. Recommended footprint

2.5 Module reflow installation

The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final

assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-

020C, July 2004 recommendations.



 PP

 PP

 PP

PP

PP

 PP

*63*60'

Table 8. Soldering profile

Profile feature Lead-free assembly

Average ramp-up rate (T

SMAX

to T

) 3 °C/sec max

Preheat:

– Temperature min. (T

min.)

– Temperature max. (T

max.)

– Time (t

min. to t

max.)(t

)

150 °C

200 °C

60-100 sec

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